EOR - Physical Rock Structure with vertical crack

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As low as €660.00

per pack of 3

Enhanced Oil Recovery - Physical Rock Structure with vertical crack.

This porous medium chip uses our Enhanced Oil Rcecovery Physical rock structure (sandstone) combined with a vertical crack added to the model.
The models help to provide insight how such a crack or void wil influence oil recovery. 

The crack is marked in red in the picture below and is a void in the actual structure.
This product is available with a 150, 400 or 600µm wide crack. The crack has a length of 8mm.

The surface of this product is hydrophilic by default, but a version with a hydrophobic coating is also available.

EOR Physical Rock with 600µm vertical crack

This model is established together with Prof. Sebastiao Lucena from the Universidade Federal do Ceará.


More Information
Unit of measurementpack of 3
Alternative item references03200, 03204, EOR.PR.CR.V150; 03201, 03205, EOR.PR.CR.V400; 03202, 03206, EOR.PR.CR.V600
ApplicationEnhanced Oil Recovery
Interface typeTopconnect
Chip thickness1.8mm
Chip materialBorosilicate glass
Number of inlets1
Number of outlets1
EOR network typePhysical Rock Structure (Sandstone) - Vertical Crack
Icon Label Description Type Size Download
pdf EOR PR 20.2 Crack 150µm Drawing for the EOR porous medium chip with a Physical Rock Network that contains a 150µm crack. Items 03200 and 03204. pdf 143.6 KB Download
pdf EOR PR 20.2 Crack 400µm Drawing for the EOR porous medium chip with a Physical Rock Network that contains a 400µm crack. Items 03201 and 03205. pdf 144.3 KB Download
pdf EOR PR 20.2 Crack 600µm Drawing for the EOR porous medium chip with a Physical Rock Network that contains a 600µm crack. Items 03202 and 03206. pdf 144.3 KB Download
Customer Questions
Which pressure and temperature can the EOR chip hold?
The EOR chip itself is manufactured from glass an can easily withstand up to 300⁰C. The chips are supplied in a black fluidic cartridge however. This cartridge can widthstand up to 80⁰C. No sealant is used, the two layers of glass are fusion bonded together. The chip can withstand easily up to 100 bar. The external interfacing is more critical however. Our Fluidic Connect holder offers the largest pressure, up to 80 bars (maybe less at elevated temperatures). Please note that it might be helpful to practice a little with the Fluidic Connect holder first. You need to get the feeling to apply not too much force, which might break the chip, but enough to obtain sufficient sealing. It might be necessary to tighten a bit more when pressure and temperature are increased. Please remove the pressure before additional tightening.
What's important in selection of a suitable microscope objective (regular bottom thickness chips)?
A inverted miscope is recommend, as most surface for observation is on the bottom (non-inlet side).
The objective working distance is a critical parameter for selection of an objective.  Most default objectives are indented for a #1.5 cover slip which is only 170µm thick, where the thickness below channel is mostly in the range of 400-900µm.   
Those objectives with longer working distance are often called non-coverglass objectives.
Where possible we would recommend to work dry. In most cases it should be possible to use the channel edge or other well defined point  as reference for manual size corrections, this would reduce the need for corrections by the objective.
What is the roughness of the etched structures?
Wet etched structures are extremely smooth and have a roughness in Angstrom range. The structures are fully optical transparent. 
Large roughness for structures in glass chips is typical observed for structures manufactured by use of laser assisted manufacturing techniques or abrasion-based techniques like powder blasting. Almost all catalogue products from Micronit are manufactured using wet etching to create full transparent channels without substantial roughness. 
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