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3-pack EOR chips (uniform network)

Availability: In stock

3-pack of chips with uniform channel network for Enhanced Oil Recovery research, reservoir engineering, or environmental research.

Enhanced Oil Recovery chips with a uniform channel network, with optional hydrophobic coating

Pack of 3 chips containing a uniform channel network representing a porous media or rock structure. These microfluidic chips can be used in Enhanced Oil Recovery research, reservoir engineering, or environmental research. They are for instance used to verify simulation models of rock-pore structures in the EOR field.

Here is a paper using Micronit's uniform network chip to promote mixing and monodisperse bubble generation in foam and EOR research:
Jong, Stephen Yin-Chyuan, and Quoc Phuc Nguyen. "Effect of microemulsion on foam stability." Applied Nanoscience (2018): 1-9.

The optional coating is applied in provided on a best effort base, it might be possible that some area's where geometries are not interconnected will stay uncoated.

Product CodeEOR_UN
Product reference for orderPlease use the following product references for an order:
- Uncoated (hydrophilic) chips: FC_EOR.UN.20.2_PACK
- Coated (hydrophobic) chips: 02198
Number of chips per pack3
Distance between channel and top surface1100 µm
Distance between channel and bottom surface680 µm
Channel locationN/A
Total chip thickness1800 µm
Chip size45 mm x 15 mm (glass element)
Channel width50 µm
Channel height20 µm
Rockpore volume2.1 µl
Combined volume inlet and outlet channel0.9 µl
Combined volume of inlet and outlet hole2.7 µl
Total internal volume5.5 µl
Permeability2.5 Darcy
Number of Inlets1
Number of outlets1
Inlet/outlet hole sizes on top of the chip1.70 mm
Inlet/outlet holes size at channel0.60 mm
Optical propertiesOptical clear view from all sides
Supplied in Fluidic slide?Yes
Material chipBorosilicate glass
Material black cartridgePolypropylene

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  EOR designs

How do I clean my chips?

One simple but very effective way to clean a microchip is to flush an alkaline solution through the channels. A solution of 1 M sodium hydroxide in water works well but a lower concentration might also be sufficient. If traces of the cleaning solution remaining inside the chip after cleaning and rinsing with water pose a problem then ammonia can be used instead. Note that these solutions are caustic and can cause damage to e.g. the polyimide coating of fused silica capillaries. Also plastic parts should not be exposed to very alkaline solutions.

In order to aid in the removal of particulate matter, a water bath with ultrasonic agitation can be used, preferably while flushing a watery solution through the channels using a Fluidic connect kit.

Glass microchips can be heated (e.g. >400° C) causing any organic material adsorbed on the glass surface to degrade. Try to use lower temperatures first because burning the content could make it stick. Make sure you only heat the glass chip and not the plastic parts around it.

Concentrated sulphuric acid works well to dissolve organic material such as fibres which are difficult to remove with alkaline solutions, but because of the extremely corrosive nature of the material a cleaning procedure is not so easily implemented.

Please note that chips that were coated by Micronit have different guidelines for cleaning.

How do I clean my coated chips?

Chips that have Micronit’s standard hydrophobic coating can be cleaned with most organic solvents. IPA, acetone, ethanol and water should all be safe to use without damaging the coating. Do not clean the chips with any very acidic or alkaline chemical. Also, flush the chip with your cleaning material but don’t store the chip for many days with an organic solvent inside. Coated chips can be stored filled with water or air. 

My chips are clogged, how do I prevent this?

Have a look at our clogging prevention guide

What are the material properties for BOROFLOAT glass?

Thermal properties Brorofloat® 33

Coefficient of Linear


Expansion (C.T.E.)

α (20–300 °C)

3.25 x 10–6 K–1

(to ISO 7991)

Specific Heat Capacity

cp (20–100 °C)

0.83 KJ x (kg x K)–1

Thermal Conductivity

λ (90 °C)

1.2 W x (m x K)–1